Process Sensors Corporation

FAQs

What spot size and FOV is achievable at typical semiconductor furnace standoff distances?

Spot size depends on the FOV ratio and measurement distance. With a 300:1 FOV ratio (PSC-M and SR55 series), you achieve a 1 mm spot at 300 mm standoff -suitable for measuring small features or wafer zones through restricted viewports. The PSC-M323 offers a 200:1 ratio with focusable laser-sighted optics for close-range precision work. Our application specialists will calculate the exact spot size at your required standoff and recommend the appropriate sighting configuration