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For RTP and RTA, the PSC-M311/M322 series is the primary recommendation. Sub-1 ms response time is essential to track rapid thermal ramps -wafer temperatures can change at 50–300°C per second in these processes. The 2-color capability accounts for emissivity variations across wafer film stacks, and the 300:1 FOV enables precise measurements through small furnace viewports. Our application team will confirm the exact model based on your chamber geometry and access conditions.