Semiconductors run the world. Phones, computers, televisions, refrigerators, LED bulbs-these are just a few of the devices semiconductors help function. Modern society wouldn't be what it is today without this critical component. But despite being such an integral part of many people's daily lives, only a few understand how it's made.
Semiconductor device fabrication is the process used to create chips, the integrated circuits present in all the latest advanced technology. In a complex, multi-step process, electronic circuits are gradually created on a pre-cut wafer made of pure semiconductor material. The semiconductor material itself can be made from a variety of compounds, such as germanium and gallium arsenide. Currently, silicon is the most commonly used semiconductor material, thanks to how abundant and inexpensive it is. For silicon semiconductor wafers, infrared temperature sensing is essential in growing the crystals, wafer annealing, wafer deposition, and wafer polishing which goes into making a chip.
However, with the introduction and advantages of silicon carbide (SiC) for used for high voltage and higher power temperature applications. Greater hardness, low thermal expansion, and higher conductivity will make it pass silicon's popularity. A significant increase in system efficiency and far higher system frequencies than today's silicon based devices. The markets for SiC (which have a high demand for power electronics) are for electric vehicles, aka EVs, plugin hybrids, and full hybrids. The characteristics of SiC enables devices to operate at higher temperatures, frequencies, and voltage.
The following graphic depicts the Silicon carbide manufacturing process. Specific areas important for accurate non-contact infrared temperature measurement are highlighted.